Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998267 | Wafer-level chip-size package with redistribution layer | Yan-Liang Ji | 2021-05-04 |
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2019-03-26 |
| 9953954 | Wafer-level chip-scale package with redistribution layer | Yan-Liang Ji | 2018-04-24 |