Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633936 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2017-04-25 |
| 9627311 | Chip package, package substrate and manufacturing method thereof | Ta-Jen Yu | 2017-04-18 |
| 9597752 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Tao Cheng, Shih-Chin Lin | 2017-03-21 |
| 9553040 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2017-01-24 |
| 9520349 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2016-12-13 |
| 9437577 | Package on package structure with pillar bump pins and related method thereof | Shih-Chin Lin | 2016-09-06 |
| 9437457 | Chip package having a patterned conducting plate and method for forming the same | Ming-Chieh Lin, Ta-Jen Yu | 2016-09-06 |
| 9373526 | Chip package and method for forming the same | Ming-Chieh Lin, Ta-Jen Yu | 2016-06-21 |
| 9252068 | Semiconductor package | Tai-Yu Chen, Chung-Fa Lee, Shih-Chin Lin | 2016-02-02 |
| 9184107 | Semiconductor package | Tai-Yu Chen, Chung-Fa Lee, Shih-Chin Lin | 2015-11-10 |
| 9177899 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2015-11-03 |
| 9000581 | Semiconductor package | Tai-Yu Chen, Chung-Fa Lee, Shih-Chin Lin | 2015-04-07 |
| 8952552 | Semiconductor package assembly systems and methods using DAM and trench structures | Ruey Kae Zang | 2015-02-10 |
| 7465885 | Circuit carrier and package structure thereof | Ming-Ren Chi | 2008-12-16 |