| 11967570 |
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more |
2024-04-23 |
| 11705413 |
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more |
2023-07-18 |
| 11302657 |
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more |
2022-04-12 |
| 11227846 |
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more |
2022-01-18 |
| 9252068 |
Semiconductor package |
Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin |
2016-02-02 |
| 9184107 |
Semiconductor package |
Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin |
2015-11-10 |
| 9000581 |
Semiconductor package |
Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin |
2015-04-07 |