Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2024-04-23 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2023-07-18 |
| 11302657 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2022-04-12 |
| 11227846 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2022-01-18 |
| 9252068 | Semiconductor package | Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin | 2016-02-02 |
| 9184107 | Semiconductor package | Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin | 2015-11-10 |
| 9000581 | Semiconductor package | Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin | 2015-04-07 |