Chung-Fa Lee — 7 Patents at Mediatek

Chung-Fa Lee has been granted 7 US patents while listed as an inventor at Mediatek. The first was granted in 2015 and the most recent in April 2024. Chung-Fa Lee ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Chung-Fa Lee in 埔鹽鄉, TW.

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Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date
11967570	Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure	Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more	2024-04-23
11705413	Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure	Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more	2023-07-18
11302657	Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure	Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more	2022-04-12
11227846	Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure	Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more	2022-01-18
9252068	Semiconductor package	Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin	2016-02-02
9184107	Semiconductor package	Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin	2015-11-10
9000581	Semiconductor package	Tai-Yu Chen, Wen-Sung Hsu, Shih-Chin Lin	2015-04-07

Chung-Fa Lee — 7 Patents

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