Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

US Patent 11967570 · Granted Apr 23, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor processing tool and methods of operation2025
Thermal-aware task scheduling2025
Integrated circuit configurable to perform adaptive thermal ceiling control in p2025
Extrinsic calibration parameter generating device, method, and non-transitory co2025
Antenna-in-module package-on-package with air trenches2025
Antenna-in-module package-on-package with air trenches2025
Robot fish system2025
Acoustic particle deflection in lithography tool2025
Methods of cleaning a lithography system2025
Encapsulated package including device dies connected via interconnect die2025
Semiconductor structure and manufacturing method thereof2025
Semiconductor structure and manufacturing method thereof2025