Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

US Patent 11469201 · Granted Oct 11, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structure2025
Wireless power system with communications2025
Wireless power system with communications2025
Semiconductor device and manufacturing method thereof2025
Management of near field communications using a low power express mode of an ele2025
Semiconductor package structure having an annular frame with truncated corners2024
Semiconductor package having an interposer in which one or more dies are formed 2024
Lidded semiconductor package2024
Semiconductor package structure2024
Semiconductor device with dummy thermal features on interposer2024
Semiconductor package structure2024
Semiconductor package structure2024