Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093722 | System-in-package with fan-out WLCSP | Chih-Tai Hsu | 2012-01-10 |
| 8044496 | QFN semiconductor package | Tung-Hsien Hsieh | 2011-10-25 |
| 8039933 | QFN semiconductor package | Tung-Hsien Hsieh | 2011-10-18 |
| 8039319 | Method for fabricating QFN semiconductor package | Tung-Hsien Hsieh | 2011-10-18 |
| 7838975 | Flip-chip package with fan-out WLCSP | — | 2010-11-23 |
| 7786557 | QFN Semiconductor package | Tung-Hsien Hsieh | 2010-08-31 |
| 7561481 | Memory controllers and pad sequence control methods thereof | Chih-Hui Kuo, Jui-Hsing Tseng, Ching-Chih Li, Pei-San Chen | 2009-07-14 |