Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen +1 more | 2023-08-08 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2023-06-27 |
| 11081475 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2021-08-03 |
| 10847869 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen +1 more | 2020-11-24 |
| 10128192 | Fan-out package structure | Che-Ya Chou, Nan-Cheng Chen | 2018-11-13 |
| 9583424 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2017-02-28 |
| 8916972 | Adhesion between post-passivation interconnect structure and polymer | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2014-12-23 |