Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadframe package for high-speed data rate applications

Leadframe package for high-speed data rate applications

US Patent 8525310 · Granted Sep 3, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Module connector2025
Right-angle turning method for small-diameter TBM exploration adit excavation2025
Semiconductor structure and semiconductor device2025
Semiconductor device2025
Package component2025
Phase-change memory cell and method for fabricating the same2025
Techniques for forming a deep trench isolation structure between photodiodes by 2025
Integrating sphere2025
Vise quick-change base with improved structure2024
Semiconductor structure and method of manufacturing the same2024
Semiconductor device and semiconductor component including the same2024
Electromigration evaluation methodology with consideration of both self-heating 2024