Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672723 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2020-06-02 |
| 10672631 | Method and system for substrate thinning | Yi-Chao Mao, Szu-Wei Lu | 2020-06-02 |
| 10518387 | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same | Yi-Chao Mao, Jing-Cheng Lin, Wen-Hua Chang | 2019-12-31 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10276516 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2019-04-30 |
| 10077351 | Graphene dispersion and graphene reinforced polymer | Bor Z. Jang, Aruna Zhamu, Feng-Yu Tsai, Dung-Yue Su, Che-Chen Hsu +3 more | 2018-09-18 |
| 10017008 | Subsidiary loudspeaker for vehicles and bikes | — | 2018-07-10 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9960125 | Method of forming a semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2018-05-01 |
| 9953907 | PoP device | Jing-Cheng Lin, Nai-Wei Liu, Wan-Ting Shih | 2018-04-24 |
| 9941244 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Tsei-Chung Fu, Jing-Cheng Lin | 2018-04-10 |
| 9748531 | Cap assembly for battery | Sheng-Fa Yeh, Chiou-Chu Lai, Deng-Tswen Shieh, Chich-Lun Lo, Shu-Ping Lin +2 more | 2017-08-29 |
| 9741689 | 3-D package having plurality of substrates | Jing-Cheng Lin, Chen-Hua Yu | 2017-08-22 |
| 9679783 | Molding wafer chamber | Jing-Cheng Lin, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2017-06-13 |
| 9431367 | Method of forming a semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2016-08-30 |
| 9425128 | 3-D package having plurality of substrates | Jing-Cheng Lin, Chen-Hua Yu | 2016-08-23 |
| 9406598 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-02 |
| 9064879 | Packaging methods and structures using a die attach film | Jui-Pin Hung, Jing-Cheng Lin, Nai-Wei Liu, Chen-Hua Yu, Shin-Puu Jeng +3 more | 2015-06-23 |
| 9059487 | Battery with soaking plate for thermally and electrically conductive channel | Sheng-Fa Yeh, Chiou-Chu Lai, Deng-Tswen Shieh, Chich-Lun Lo, Shu-Ping Lin +2 more | 2015-06-16 |
| 8933551 | 3D-packages and methods for forming the same | Jing-Cheng Lin, Chen-Hua Yu | 2015-01-13 |
| 8872326 | Three dimensional (3D) fan-out packaging mechanisms | Jing-Cheng Lin, Jui-Pin Hung | 2014-10-28 |
| 8785026 | Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery system | Hsien-Lin Hu, Jenn-Dong Hwang, Cheng-Chou Wong, Sheng-Fa Yeh, Bing-Ming Lin +1 more | 2014-07-22 |
| 8785299 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin | 2014-07-22 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao +7 more | 2014-01-14 |
| 8459004 | Oxygen sensor bung of motor vehicle exhaust pipe | — | 2013-06-11 |