Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397279 | Electric conductive heat dissipation substrate | Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen | 2016-07-19 |
| 8785026 | Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery system | Hsien-Lin Hu, Jenn-Dong Hwang, Chin-Chuan Chang, Sheng-Fa Yeh, Bing-Ming Lin +1 more | 2014-07-22 |
| 8373991 | Metal thermal interface material and thermal module and packaged microelectronic component containing the material | Yuan-Chang Fann, Chun-Mu Chen, Chih-Tsung Tu, Jen-Dong Hwang | 2013-02-12 |
| 7952192 | Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof | Yuan-Chang Fann, Jenn-Dong Hwang | 2011-05-31 |
| 7576428 | Melting temperature adjustable metal thermal interface materials and application thereof | Yuan-Chang Fann, Jen-Dong Hwang | 2009-08-18 |