Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8373991 | Metal thermal interface material and thermal module and packaged microelectronic component containing the material | Yuan-Chang Fann, Chun-Mu Chen, Cheng-Chou Wong, Jen-Dong Hwang | 2013-02-12 |