Issued Patents All Time
Showing 51–75 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081391 | Wafer level dicing method and semiconductor device | Hsien-Wei Chen | 2021-08-03 |
| 11056433 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2021-07-06 |
| 11018069 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2021-05-25 |
| 10964659 | Semiconductor device | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2021-03-30 |
| 10943889 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2021-03-09 |
| 10923421 | Package structure and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2021-02-16 |
| 10886238 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2021-01-05 |
| 10818615 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-27 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10797001 | Three-dimensional integrated circuit structures | Jie Chen, Hsien-Wei Chen | 2020-10-06 |
| 10720385 | Semiconductor structure | Hsien-Wei Chen | 2020-07-21 |
| 10718771 | Recombinant baculoviruses and their uses in detecting arthropod-borne virus | Tzong-Yuan Wu, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO +3 more | 2020-07-21 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658339 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2020-05-12 |
| 10643965 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |
| 10629560 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2020-04-21 |
| 10515865 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10504852 | Three-dimensional integrated circuit structures | Jie Chen, Hsien-Wei Chen | 2019-12-10 |
| 10475760 | Semiconductor device | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2019-11-12 |
| 10366953 | Redistribution layer structures for integrated circuit package | Jie Chen, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen | 2019-07-30 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2019-07-09 |
| 10340240 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2019-07-02 |
| 10325865 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2019-06-18 |
| 10262952 | Ring structures in device die | Jie Chen, Hsien-Wei Chen | 2019-04-16 |