Issued Patents All Time
Showing 76–100 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10216371 | Method and electronic apparatus for associating note and calendar event | David Folchi | 2019-02-26 |
| 10181449 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2019-01-15 |
| 10163807 | Alignment pattern for package singulation | Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai | 2018-12-25 |
| 10163866 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2018-12-25 |
| 10157892 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Wen-Chih Chiou | 2018-12-18 |
| 10157867 | Interconnect structure and method | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu | 2018-12-18 |
| 10074584 | Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer | Hsien-Wei Chen | 2018-09-11 |
| 10074618 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2018-09-11 |
| 10037953 | Contact pad for semiconductor devices | Jie Chen, Hsien-Wei Chen | 2018-07-31 |
| 10032712 | Semiconductor structure | Hsien-Wei Chen | 2018-07-24 |
| 10008413 | Wafer level dicing method | Hsien-Wei Chen | 2018-06-26 |
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Hsien-Wei Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang | 2018-06-12 |
| 9991247 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2018-06-05 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9978704 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2018-05-22 |
| 9911707 | Structure and method of forming a pad structure having enhanced reliability | Hsien-Wei Chen | 2018-03-06 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Shang-Yun Hou +2 more | 2018-01-02 |
| 9852998 | Ring structures in device die | Jie Chen, Hsien-Wei Chen | 2017-12-26 |
| 9842788 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2017-12-12 |
| 9831205 | Semiconductor device and manufacturing method thereof | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2017-11-28 |
| 9831140 | Wafer having pad structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2017-11-28 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, Li-Hsien Huang, An-Jhih Su, Wei-Yu Chen | 2017-11-28 |
| 9825008 | Package-on-package device with supplemental underfill and method for manufacturing the same | Jie Chen, Hsien-Wei Chen | 2017-11-21 |
| 9812430 | Package on-package method | Hsien-Wei Chen, An-Jhih Su | 2017-11-07 |
| 9806235 | Light emitting diode bracket | Ching-Huei Wu, Chih-Chao Chang, Ping Wu | 2017-10-31 |