Issued Patents All Time
Showing 126–150 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349665 | Methods and apparatus of packaging of semiconductor devices | Hsien-Wei Chen, Tsung-Yuan Yu, Jie Chen | 2016-05-24 |
| 9328147 | Recombinant baculovirus vector and uses thereof | Tzong-Yuan Wu, Mean-Shine Chen, Chao-Yi Teng | 2016-05-03 |
| 9313629 | Method and system for filtering incoming messages to a mobile device | John C. Wang | 2016-04-12 |
| 9269675 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2016-02-23 |
| 9269682 | Method of forming bump structure | Tsung-Yuan Yu, Hsien-Wei Chen | 2016-02-23 |
| 9267113 | Hybrid baculovirus and uses thereof | Tzong-Yuan Wu, Mean-Shine Chen, Chao-Yi Teng, Chung-Hsiung Wang | 2016-02-23 |
| 9263354 | Pillar structure having cavities | Hsien-Wei Chen | 2016-02-16 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2016-01-26 |
| 9224709 | Semiconductor device including an embedded surface mount device and method of forming the same | Hsien-Wei Chen | 2015-12-29 |
| 9208222 | Note management methods and systems | David Folchi | 2015-12-08 |
| 9196529 | Contact pad for semiconductor devices | Jie Chen, Hsien-Wei Chen | 2015-11-24 |
| 9196586 | Semiconductor package including an embedded surface mount device and method of forming the same | Hsien-Wei Chen, Ming-Yen Chiu, Der-Chyang Yeh | 2015-11-24 |
| 9171811 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Hsiu-Ping Wei | 2015-10-27 |
| 9157072 | Hybrid baculovirus having the capability of infecting at least three insect hosts and uses thereof | Tzong-Yuan Wu, Mean-Shine Chen, Chao-Yi Teng | 2015-10-13 |
| 9136318 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2015-09-15 |
| 9129816 | Contact test structure and method | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2015-09-08 |
| 9105588 | Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer | Hsien-Wei Chen | 2015-08-11 |
| 9093411 | Pad structure having contact bars extending into substrate and wafer having the pad structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2015-07-28 |
| 9006891 | Method of making a semiconductor device having a post-passivation interconnect structure | Shih-Wei Liang, Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2015-04-14 |
| 9000876 | Inductor for post passivation interconnect | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2015-04-07 |
| 8994181 | Bond pad structure to reduce bond pad corrosion | Hsien-Wei Chen, Tsung-Yuan Yu, Shih-Wei Liang | 2015-03-31 |
| 8982077 | Portable electronic apparatus to bypass screen lock mode for electronic notebook and operation method thereof and computer readable media | David Folchi | 2015-03-17 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Tung-Liang Shao +3 more | 2015-02-24 |
| 8952530 | Post passivation interconnect structures and methods for forming the same | Hsien-Wei Chen | 2015-02-10 |
| 8916465 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2014-12-23 |