Issued Patents All Time
Showing 151–173 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8907478 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Hsiu-Ping Wei | 2014-12-09 |
| 8884400 | Capacitor in Post-Passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2014-11-11 |
| 8871629 | Methods of and semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2014-10-28 |
| 8723325 | Structure and method of forming a pad structure having enhanced reliability | Hsien-Wei Chen | 2014-05-13 |
| 8722529 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2014-05-13 |
| 8692378 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2014-04-08 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Tung-Liang Shao, Shih-Wei Liang, Ching-Jung Yang, Hsien-Wei Chen, Hao-Yi Tsai +2 more | 2013-12-31 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Tung-Liang Shao +3 more | 2013-12-17 |
| 8581400 | Post-passivation interconnect structure | Shih-Wei Liang, Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2013-11-12 |
| 8581423 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2013-11-12 |
| 8519792 | Differential voltage sensing system and method for using the same | Wen-Ying Chang, Cheng-Hung Chang | 2013-08-27 |
| 8450126 | Semiconductor test pad structures | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2013-05-28 |
| 8442628 | Differential voltage sensing method | Wen-Ying Chang, Cheng-Hung Chang | 2013-05-14 |
| 8405211 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Hsiu-Ping Wei | 2013-03-26 |
| 8315607 | Method and system for filtering incoming messages to a mobile device | John C. Wang | 2012-11-20 |
| 8278737 | Structure for improving die saw quality | Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu, Shin-Puu Jeng | 2012-10-02 |
| 8237160 | Probe pad on a corner stress relief region in a semiconductor chip | Hsien-Wei Chen, Chung-Ying Yang, Shih-Wei Liang, Ching-Jung Yang | 2012-08-07 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Hsiu-Ping Wei, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu +1 more | 2012-07-24 |
| 8013333 | Semiconductor test pad structures | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2011-09-06 |
| D641020 | Slim display | Wei-Ming Shih, Hui-An Ko | 2011-07-05 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng | 2011-05-03 |
| 7588885 | Use of biocistronic DNA constructs for identifying compounds that inhibit IRES-dependent translation | Tzong-Yuan Wu, Shin-Jhan Zeng, Tsu-An Hsu, Shin-Ru Shih, Suey-Sheng Kao +1 more | 2009-09-15 |
| 7262051 | Use of biscistronic DNA constructs for identifying compounds that inhibit IRES-dependent translation | Tzong-Yuan Wu, Tsu-An Hsu, Shin-Ru Shih, Suey-Sheng Kao, Tzyy-Rong Jinn +1 more | 2007-08-28 |