Issued Patents All Time
Showing 101–125 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang | 2017-10-31 |
| 9793245 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2017-10-17 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9773745 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2017-09-26 |
| 9687438 | Method for enhancing collagen secretion and preventing cutaneous aging using chenopodium formosanum extract | Hsiang-Ling Su, Chin-Hsiu Yu | 2017-06-27 |
| 9646941 | Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof | Hsien-Wei Chen | 2017-05-09 |
| 9620469 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2017-04-11 |
| 9589938 | Semiconductor device including an embedded surface mount device and method of forming the same | Hsien-Wei Chen | 2017-03-07 |
| 9589891 | Contact pad for semiconductor devices | Hsien-Wei Chen, Jie Chen | 2017-03-07 |
| 9570418 | Structure and method for package warpage control using dummy interconnects | Hsien-Wei Chen | 2017-02-14 |
| 9553066 | Post passivation interconnect structures and methods for forming the same | Hsien-Wei Chen | 2017-01-24 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9549054 | Information displaying method, mobile phone, and storage device | Yuan-Mao Tsui, Chi-Min Lee | 2017-01-17 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu | 2017-01-03 |
| 9502270 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2016-11-22 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9490192 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen | 2016-11-08 |
| 9478521 | Package-on-package Structure | Hsien-Wei Chen, An-Jhih Su | 2016-10-25 |
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2016-10-04 |
| 9437567 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2016-09-06 |
| 9391028 | Integrated circuit dies having alignment marks and methods of forming same | Hsien-Wei Chen | 2016-07-12 |
| 9381175 | Method for treating Chikungunya virus infection | Szu-Cheng KUO, Tzong-Yuan Wu, Chang-Chi LIN, Yu Wang | 2016-07-05 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9368417 | Contact test structure and method | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2016-06-14 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2016-05-31 |