Issued Patents All Time
Showing 26–50 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2023-11-14 |
| 11791246 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2023-10-17 |
| 11764165 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2023-09-19 |
| 11747317 | Underwater robot water quality data acquisition device and control method thereof | Jing Zhou, Yuchao Che, Jian Gao, Liming Zhao, Haocai Huang | 2023-09-05 |
| 11735555 | Manufacturing method of semiconductor structure | Jie Chen, Hsien-Wei Chen | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2023-08-22 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-08-01 |
| 11705343 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2023-07-18 |
| 11699663 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2023-07-11 |
| 11495559 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-11-08 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11362066 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh | 2022-06-14 |
| 11355468 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11315855 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2022-04-26 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-04-19 |
| 11270989 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2022-03-08 |
| 11257775 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2022-02-22 |
| 11195804 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2021-12-07 |
| 11183475 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2021-11-23 |
| 11177201 | Semiconductor packages including routing dies and methods of forming same | Jie Chen, Hsien-Wei Chen | 2021-11-16 |
| 11164857 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2021-11-02 |
| 11133304 | Packaging scheme involving metal-insulator-metal capacitor | Hsiang-Ku Shen, Hsien-Wei Chen | 2021-09-28 |
| 11107680 | Mask assembly and method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2021-08-31 |
| 11099916 | Method and device for presenting information on terminal | Tao Guo, Yi Zhong | 2021-08-24 |