Issued Patents All Time
Showing 51–75 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205856 | Semiconductor structure including interconnection to probe pad with probe mark | Ching-Jung Yang, Jie Chen | 2025-01-21 |
| 12205911 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2025-01-21 |
| 12199049 | Advanced seal ring structure and method of making the same | — | 2025-01-14 |
| 12199024 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2025-01-14 |
| 12191163 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2025-01-07 |
| 12191283 | Manufacturing method of three-dimensional stacking structure | Jie Chen, Ming-Fa Chen | 2025-01-07 |
| 12183728 | Process control for package formation | Ming-Fa Chen | 2024-12-31 |
| 12176248 | Wafer level dicing method and semiconductor device | Ying-Ju Chen | 2024-12-24 |
| 12176257 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer | Sheng-An Kuo, Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2024-12-24 |
| 12176270 | Package structure with photonic die and method | Ming-Fa Chen, Ying-Ju Chen | 2024-12-24 |
| 12176344 | Methods of forming semiconductor structure | Ming-Fa Chen | 2024-12-24 |
| 12170207 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2024-12-17 |
| 12165971 | Package having different metal densities in different regions and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sen-Bor Jan | 2024-12-10 |
| 12165980 | Semiconductor package and methods of manufacturing | Meng-Liang Lin, Shin-Puu Jeng | 2024-12-10 |
| 12154876 | Semiconductor interconnect structure and method | Jie Chen | 2024-11-26 |
| 12148728 | Multi-chip integrated fan-out package | Jie Chen | 2024-11-19 |
| 12136619 | Methods of manufacturing three-dimensional integrated circuit structures | Ming-Fa Chen, Sung-Feng Yeh | 2024-11-05 |
| 12125769 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2024-10-22 |
| 12119338 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2024-10-15 |
| 12119320 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2024-10-15 |
| 12119318 | Bonding structure and method of forming same | Jie Chen, Ming-Fa Chen | 2024-10-15 |
| 12113036 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu | 2024-10-08 |
| 12087755 | Method of fabricating package structure | Jie Chen, Ming-Fa Chen | 2024-09-10 |
| 12087668 | Semiconductor package and method for manufacturing the same | Jie Chen, Ming-Fa Chen | 2024-09-10 |
| 12080702 | Method of fabricating package structure | Jie Chen, Ming-Fa Chen | 2024-09-03 |