Issued Patents All Time
Showing 101–125 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942454 | Package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2024-03-26 |
| 11942436 | Passivation scheme design for wafer singulation | Ying-Ju Chen, Ming-Fa Chen | 2024-03-26 |
| 11935802 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2024-03-19 |
| 11929322 | Method of forming device and package structure | An-Jhih Su, Li-Hsien Huang | 2024-03-12 |
| 11908836 | Semiconductor package and method of manufacturing semiconductor package | Ming-Fa Chen | 2024-02-20 |
| 11908817 | Bonding structure of dies with dangling bonds | Ming-Fa Chen, Chih-Chia Hu | 2024-02-20 |
| 11908692 | Method for fabricating a chip package | Jie Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2024-02-20 |
| 11899242 | Method of manufacturing a packaged device with optical pathway | Ming-Fa Chen | 2024-02-13 |
| 11869819 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2024-01-09 |
| 11862605 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2024-01-02 |
| 11862599 | Bonding to alignment marks with dummy alignment marks | Ying-Ju Chen, Ming-Fa Chen | 2024-01-02 |
| 11862590 | Integrated circuit package and method of forming thereof | Ming-Fa Chen, Ying-Ju Chen | 2024-01-02 |
| 11862606 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2024-01-02 |
| 11856800 | Semiconductor devices with system on chip devices | Chen-Hua Yu, Wen-Chih Chiou, Ming-Fa Chen, Sung-Feng Yeh | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11854967 | Semiconductor packages | Jie Chen, Ming-Fa Chen | 2023-12-26 |
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Jie Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11855063 | Buffer design for package integration | Jie Chen, Ming-Fa Chen, Chen-Hua Yu | 2023-12-26 |
| 11848267 | Functional component within interconnect structure of semiconductor device and method of forming same | Ming-Fa Chen | 2023-12-19 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Der-Chyang Yeh, Chen-Hua Yu | 2023-12-19 |
| 11846802 | Semiconductor structure | Ming-Fa Chen | 2023-12-19 |
| 11848246 | Integrated circuit package and method | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-19 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837578 | Package structure | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-05 |