Issued Patents All Time
Showing 151–175 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2023-08-22 |
| 11735536 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Ying-Ju Chen | 2023-08-22 |
| 11728334 | Three-dimensional integrated circuit structures and method of forming the same | Jie Chen | 2023-08-15 |
| 11728324 | Semiconductor structure having photonic die and electronic die | Ming-Fa Chen | 2023-08-15 |
| 11728312 | Semiconductor packaging and methods of forming same | Ming-Fa Chen | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Jie Chen, Sung-Feng Yeh | 2023-08-15 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2023-08-15 |
| 11721676 | Package structure with dummy die | Li-Hsien Huang | 2023-08-08 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Ying-Ju Chen, Jie Chen, Ming-Fa Chen | 2023-08-01 |
| 11705423 | Package structure | Sung-Feng Yeh, Ming-Fa Chen | 2023-07-18 |
| 11705343 | Integrated circuit package and method of forming thereof | Ming-Fa Chen, Ying-Ju Chen | 2023-07-18 |
| 11699663 | Passivation scheme design for wafer singulation | Ying-Ju Chen, Ming-Fa Chen | 2023-07-11 |
| 11682594 | Semiconductor structure including interconnection to probe pad with probe mark | Ching-Jung Yang, Jie Chen | 2023-06-20 |
| 11676942 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2023-06-13 |
| 11676939 | Discrete polymer in fan-out packages | Jie Chen | 2023-06-13 |
| 11670621 | Die stack structure | Jie Chen, Ming-Fa Chen | 2023-06-06 |
| 11664336 | Bonding structure and method of forming same | Jie Chen, Ming-Fa Chen | 2023-05-30 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11640958 | Packaged die and RDL with bonding structures therebetween | Jie Chen | 2023-05-02 |
| 11626378 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | — | 2023-04-11 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2023-04-11 |
| 11621214 | Semiconductor package and method for manufacturing the same | Jie Chen, Ming-Fa Chen | 2023-04-04 |