Issued Patents All Time
Showing 176–200 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2023-03-21 |
| 11609391 | Semiconductor package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2023-03-21 |
| 11600587 | Pad design for reliability enhancement in packages | — | 2023-03-07 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11587922 | Process control for package formation | Ming-Fa Chen | 2023-02-21 |
| 11587907 | Package structure | Tzuan-Horng Liu, Jiun-Heng Wang, Ming-Fa Chen | 2023-02-21 |
| 11574878 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Ming-Fa Chen | 2023-02-07 |
| 11574847 | Seal ring between interconnected chips mounted on an integrated circuit | Jie Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-02-07 |
| 11562935 | Semiconductor structure | Ching-Jung Yang, Ming-Fa Chen | 2023-01-24 |
| 11557581 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen | 2023-01-17 |
| 11532524 | Integrated circuit test method and structure thereof | Hsien-Wen Liu | 2022-12-20 |
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2022-12-20 |
| 11532598 | Package structure with protective structure and method of fabricating the same | Ching-Jung Yang, Ming-Fa Chen | 2022-12-20 |
| 11527490 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2022-12-13 |
| 11527417 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2022-12-13 |
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2022-12-13 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11495559 | Integrated circuits | Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-11-08 |
| 11482499 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2022-10-25 |
| 11482649 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Jie Chen | 2022-10-25 |
| 11476201 | Package-on-package device | Ming-Fa Chen, Sung-Feng Yeh | 2022-10-18 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11462458 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2022-10-04 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2022-09-27 |