Issued Patents All Time
Showing 226–250 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362066 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Ming-Fa Chen | 2022-06-14 |
| 11362065 | Package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2022-06-14 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11347001 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen | 2022-05-31 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Jie Chen, Sen-Bor Jan, Sung-Feng Yeh | 2022-05-24 |
| 11342196 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11335610 | Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same | Ching-Jung Yang, Jie Chen | 2022-05-17 |
| 11315855 | Package structure with photonic die and method | Ming-Fa Chen, Ying-Ju Chen | 2022-04-26 |
| RE49046 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang | 2022-04-19 |
| 11309291 | Die stack structure and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-04-19 |
| 11309289 | Integrated circuit package having heat dissipation structure | Ming-Fa Chen, Chen-Hua Yu | 2022-04-19 |
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sen-Bor Jan | 2022-04-19 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |
| 11276656 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2022-03-15 |
| 11270989 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2022-03-08 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2022-03-01 |
| 11257791 | Stacked die structure and method of fabricating the same | Jie Chen, Ming-Fa Chen | 2022-02-22 |
| 11257787 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh | 2022-02-22 |
| 11257775 | Mechanisms for forming post-passivation interconnect structure | Ying-Ju Chen | 2022-02-22 |
| 11251157 | Die stack structure with hybrid bonding structure and method of fabricating the same and package | Ching-Jung Yang | 2022-02-15 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2022-02-15 |
| 11239225 | Three-dimensional integrated circuit structures and methods of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2022-02-01 |
| 11217552 | Multi-chip integrated fan-out package | Jie Chen | 2022-01-04 |
| 11195804 | Semiconductor structure | Ying-Ju Chen, Ming-Fa Chen | 2021-12-07 |