Issued Patents All Time
Showing 201–225 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450579 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2022-09-20 |
| 11444057 | Package structures and methods of forming | Chen-Hua Yu, Der-Chyang Yeh | 2022-09-13 |
| 11444021 | Device and package structure and method of forming the same | An-Jhih Su, Li-Hsien Huang | 2022-09-13 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2022-08-30 |
| 11424205 | Semiconductor interconnect structure and method | Jie Chen | 2022-08-23 |
| 11424191 | Semiconductor devices and methods of manufacture | Ming-Fa Chen | 2022-08-23 |
| 11424189 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2022-08-23 |
| 11417619 | Package and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2022-08-16 |
| 11417610 | Post-passivation interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2022-08-16 |
| 11417599 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2022-08-16 |
| 11417587 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-08-16 |
| 11410948 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Jie Chen | 2022-08-09 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2022-08-09 |
| 11404404 | Semiconductor structure having photonic die and electronic die | Ming-Fa Chen | 2022-08-02 |
| 11393797 | Chip package with redistribution layers | Jie Chen | 2022-07-19 |
| 11387209 | Package structure | Sung-Feng Yeh, Ming-Fa Chen | 2022-07-12 |
| 11387204 | Semiconductor structure and method of fabricating the same | Jie Chen | 2022-07-12 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-07-05 |
| 11380598 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2022-07-05 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2022-06-28 |
| 11373962 | Advanced seal ring structure and method of making the same | — | 2022-06-28 |
| 11373953 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Ming-Fa Chen | 2022-06-28 |
| 11372160 | Package, optical device, and manufacturing method of package | Ming-Fa Chen | 2022-06-28 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2022-06-14 |