Issued Patents All Time
Showing 126–150 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837578 | Package structure | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-05 |
| 11830825 | Advanced seal ring structure and method of making the same | — | 2023-11-28 |
| 11823912 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2023-11-21 |
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2023-11-14 |
| 11817426 | Package and method of fabricating the same | Ming-Fa Chen | 2023-11-14 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Ming-Fa Chen | 2023-11-14 |
| 11810883 | Package structure | Ming-Fa Chen | 2023-11-07 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11798931 | Semiconductor package | Jie Chen, Ming-Fa Chen | 2023-10-24 |
| 11791333 | Three-dimensional integrated circuit structures and method of forming the same | Jie Chen | 2023-10-17 |
| 11791246 | Package structure with photonic die and method | Ming-Fa Chen, Ying-Ju Chen | 2023-10-17 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2023-10-17 |
| 11789201 | Package, optical device, and manufacturing method of package | Ming-Fa Chen | 2023-10-17 |
| 11784124 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2023-10-10 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-09-26 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11764165 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2023-09-19 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2023-09-12 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2023-09-12 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11756933 | Inactive structure on SoIC | Ming-Fa Chen, Sung-Feng Yeh | 2023-09-12 |
| 11749651 | Semiconductor package and manufacturing method thereof | Jie Chen | 2023-09-05 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11735555 | Manufacturing method of semiconductor structure | Jie Chen, Ying-Ju Chen | 2023-08-22 |