Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2025-02-11 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2023-09-05 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2021-08-03 |