Issued Patents All Time
Showing 51–75 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2023-11-28 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2023-10-17 |
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Shing-Chao Chen, Chih-Wei Lin | 2023-10-03 |
| 11764127 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Chien Ling Hwang | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2023-08-22 |
| 11721659 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2023-08-08 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2023-07-18 |
| 11688725 | Semiconductor packages | Sheng-Chieh Yang, Chih-Wei Lin, Yu-Hao Chen | 2023-06-27 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong +1 more | 2023-05-30 |
| 11646293 | Semiconductor structure and method | Chia-Shen Cheng, Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Chen-Hua Yu | 2023-05-09 |
| 11640954 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2023-05-02 |
| 11631652 | Method and apparatus for bonding semiconductor substrate | Ying-Jui Huang, Chien Ling Hwang, Chia-Sheng Huang | 2023-04-18 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2023-02-21 |
| 11585992 | Package structure | Chia-Lun Chang, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2023-02-21 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2023-01-31 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Chen-Hua Yu, Hsin-Hung Liao, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2022-12-20 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11456226 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2022-09-27 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2022-09-20 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |