Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2025-06-24 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2025-03-25 |
| 11854936 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2023-12-26 |
| 11830844 | Semiconductor structure | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2023-11-28 |
| 11756852 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2023-09-12 |
| 11640954 | Semiconductor package structure | Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2023-05-02 |
| 11574853 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2023-02-07 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2022-06-07 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2022-05-10 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2021-10-05 |
| 10971475 | Semiconductor package structure | Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |