Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322640 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2025-06-03 |
| 12125797 | Package structure with fan-out feature | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-10-22 |
| 12080653 | Formation method of chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-09-03 |
| 12033992 | Package and manufacturing method thereof | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang | 2024-07-09 |
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2023-10-03 |
| 11404381 | Chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2021-11-16 |
| 11088124 | Package and manufacturing method thereof | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang | 2021-08-10 |
| 10964663 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-30 |
| 10950572 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-16 |
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2020-12-15 |
| 10840111 | Chip package with fan-out structure | Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Ching-Hua Hsieh, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10515900 | Chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-11-12 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |
| 10157846 | Method for forming chip package involving cutting process | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 10128193 | Package structure and method for forming the same | Chih-Wei Lin, Ching-Yao Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-11-13 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2018-04-17 |
| 9425178 | RDL-first packaging process | Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-08-23 |