Issued Patents All Time
Showing 76–100 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2022-08-02 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Chien Ling Hwang +2 more | 2022-05-24 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2022-04-19 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 11251131 | Copper contact plugs with barrier layers | Li-Lin Su, Huang-Ming Chen, Hsueh Wen Tsau | 2022-02-15 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11233039 | Semiconductor packages | Sheng-Chieh Yang, Chih-Wei Lin, Yu-Hao Chen | 2022-01-25 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Chung-Shi Liu, Chen-Hua Yu | 2022-01-04 |
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Shing-Chao Chen, Chih-Wei Lin | 2021-11-16 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin | 2021-09-14 |
| 11088124 | Package and manufacturing method thereof | Shing-Chao Chen, Chih-Wei Lin, Sheng-Chieh Yang | 2021-08-10 |
| 11075439 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2021-07-27 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2021-06-29 |
| 11031376 | Chip package and method of forming the same | Hsaing-Pin Kuan, Chih-Wei Lin, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
| 11002927 | Package structure | Chia-Lun Chang, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2021-04-06 |