Issued Patents All Time
Showing 126–150 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Chien Ling Hwang, Hsin-Hung Liao, Yu-Ting Chiu | 2019-10-08 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2019-08-06 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2019-07-30 |
| 10325883 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2019-05-21 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2019-04-30 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Chung-Shi Liu, Hsiu-Jen Lin, Chia-Lun Chang | 2018-12-18 |
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2018-12-18 |
| 10128193 | Package structure and method for forming the same | Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin, Ming-Da Cheng | 2018-11-13 |
| 10103099 | Semiconductor devices and methods of forming same | Chih-Chien Chi, Huang-Yi Huang, Szu-Ping Tung | 2018-10-16 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-07-03 |
| 9984960 | Integrated fan-out package and method of fabricating the same | Chien Ling Hwang, Hsin-Hung Liao, Ying-Jui Huang | 2018-05-29 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-05-22 |
| 9887072 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ming-Hsing Tsai, Syun-Ming Jang | 2018-02-06 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2018-01-30 |
| 9873944 | Metal capping process and processing platform thereof | Chih-Chien Chi, Szu-Ping Tung, Huang-Yi Huang | 2018-01-23 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |
| 9818729 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2017-11-14 |
| 9799625 | Semiconductor structure and manufacturing method thereof | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2017-10-24 |
| 9754805 | Packaging method and structure | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2017-09-05 |