Issued Patents All Time
Showing 176–198 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8178437 | Barrier material and process for Cu interconnect | Chung-Liang Chang, Shau-Lin Shue | 2012-05-15 |
| 8034709 | Method for forming composite barrier layer | Cheng-Lin Huang, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng, Li-Lin Su +3 more | 2011-10-11 |
| 7704886 | Multi-step Cu seed layer formation for improving sidewall coverage | Li-Lin Su, Shing-Chyang Pan, Cheng-Lin Huang | 2010-04-27 |
| 7700479 | Cleaning processes in the formation of integrated circuit interconnect structures | Cheng-Lin Huang, Shau-Lin Shue | 2010-04-20 |
| 7612451 | Reducing resistivity in interconnect structures by forming an inter-layer | Chih-Chao Shih, Cheng-Lin Huang, Shau-Lin Shue | 2009-11-03 |
| 7453149 | Composite barrier layer | Cheng-Lin Huang, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng, Li-Lin Su +3 more | 2008-11-18 |
| 7443029 | Adhesion of copper and etch stop layer for copper alloy | Jing-Cheng Lin, Shau-Lin Shue, Mong-Song Liang | 2008-10-28 |
| 7338903 | Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer | Chao-Hsien Peng, Jing-Cheng Lin, Shau-Lin Shue | 2008-03-04 |
| 7253501 | High performance metallization cap layer | Hsien-Ming Lee, Jing-Cheng Lin, Shing-Chyang Pan, Chao-Hsien Peng, Cheng-Lin Huang +2 more | 2007-08-07 |
| 7235482 | Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology | Chii-Ming Wu, Ming-Hsing Tsai, Shau-Lin Shue | 2007-06-26 |
| 7215024 | Barrier-less integration with copper alloy | Jing-Cheng Lin, Cheng-Lin Huang, Shau-Lin Shue, Mong-Song Liang | 2007-05-08 |
| 7193327 | Barrier structure for semiconductor devices | Chen-Hua Yu, Shing-Chyang Pan, Shau-Lin Shue, Cheng-Lin Huang, Hsien-Ming Lee +1 more | 2007-03-20 |
| 7179759 | Barrier layer and fabrication method thereof | Cheng-Lin Huang, Shau-Lin Shue | 2007-02-20 |
| 7071095 | Barrier metal re-distribution process for resistivity reduction | Cheng-Lin Huang, Shau-Lin Shue | 2006-07-04 |
| 7030023 | Method for simultaneous degas and baking in copper damascene process | Shing-Chyang Pan, Jing-Cheng Lin, Hsien-Ming Lee, Cheng-Lin Huang, Shau-Lin Shue | 2006-04-18 |
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Jing-Cheng Lin, Shau-Lin Shue, Mong-Song Liang | 2005-11-22 |
| 6949472 | Method for high kinetic energy plasma barrier deposition | Cheng-Lin Huang, Shau-Lin Shue | 2005-09-27 |
| 6927498 | Bond pad for flip chip package | Tai-Chun Huang, Chih-Hsiang Yao | 2005-08-09 |
| 6806192 | Method of barrier-less integration with copper alloy | Jing-Cheng Lin, Cheng-Lin Huang, Shau-Lin Shue, Mong-Song Liang | 2004-10-19 |
| 6800558 | Photoresist scum for copper dual damascene process | Chung-Liang Chang | 2004-10-05 |
| 6797144 | Method for reducing surface defects in an electrodeposition process | Hung-Wen Su, Shih-Wei Chou, Shau-Lin Shue | 2004-09-28 |
| 6562725 | Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2003-05-13 |
| 6492269 | Methods for edge alignment mark protection during damascene electrochemical plating of copper | Chung-Shi Liu, Shau-Lin Shue, Chen-Hua Yu | 2002-12-10 |