Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10090243 | Inductor for semiconductor integrated circuit | Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2018-10-02 |
| 9355956 | Inductor for semiconductor integrated circuit | Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2016-05-31 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2015-07-14 |
| 8542075 | Structure and method for reducing EM radiation, and electric object and manufacturing method thereof | Tzong-Lin Wu | 2013-09-24 |
| 8508311 | Transmission line and electrical apparatus using the same | Tzong-Lin Wu, Yu-Ren Cheng | 2013-08-13 |