Issued Patents All Time
Showing 51–75 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Chung-Shi Liu | 2024-08-27 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12058101 | Package structure and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2024-08-06 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Chen-Hua Yu | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2024-07-16 |
| 12027494 | Semiconductor device and manufacturing method thereof | Tzuan-Horng Liu, Chien Ling Hwang | 2024-07-02 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2024-06-04 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2024-05-28 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11953740 | Package structure | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11948862 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2024-04-02 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2024-03-19 |
| 11935871 | Semiconductor package and method of fabricating the same | Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2024-03-05 |
| 11923318 | Method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2024-03-05 |