Issued Patents All Time
Showing 101–125 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Chien Ling Hwang +4 more | 2023-09-05 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11741737 | Fingerprint sensor in info structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2023-08-29 |
| 11735518 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Ming Hung Tseng, Hsien-Ming Tu | 2023-08-22 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2023-08-15 |
| 11694966 | Chip package and method of forming the same | Kuo Lung Pan, Tin-Hao Kuo | 2023-07-04 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2023-07-04 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2023-06-27 |
| 11682655 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2023-06-20 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo | 2023-06-20 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2023-05-30 |
| 11664315 | Structure with interconnection die and method of making same | Tzuan-Horng Liu, Ting Hao Kuo | 2023-05-30 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2023-05-09 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Chung-Shi Liu +1 more | 2023-04-25 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2023-04-11 |
| 11625940 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2023-04-11 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2023-03-28 |
| 11600431 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2023-03-07 |
| 11594460 | Semiconductor package and method of fabricating the same | Tzuan-Horng Liu | 2023-02-28 |
| 11580767 | Fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2023-02-14 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |