Issued Patents All Time
Showing 151–175 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2022-05-24 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2022-02-15 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hung-Yi Kuo, Ming Hung Tseng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2021-12-28 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11201118 | Chip package and method of forming the same | Kuo Lung Pan, Tin-Hao Kuo | 2021-12-14 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2021-12-07 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +2 more | 2021-11-23 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2021-11-16 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2021-11-16 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2021-11-09 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Tin-Hao Kuo, Chia-Hung Liu, Chi-Hui Lai | 2021-11-02 |
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Tsung-Hsien Chiang, Tin-Hao Kuo | 2021-10-26 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai +1 more | 2021-10-26 |