Issued Patents All Time
Showing 201–225 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2021-04-13 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10971477 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2021-04-06 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2021-03-16 |
| 10937718 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2021-03-02 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2021-03-02 |
| 10879221 | Package-on-package structure | Chun-Ti Lu, Chih-Hua Chen, Ming Hung Tseng, Yen-Liang Lin | 2020-12-29 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-12-29 |
| 10867911 | InFO coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hung-Yi Kuo, Ming Hung Tseng | 2020-12-15 |
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai +2 more | 2020-12-08 |
| 10861823 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Tin-Hao Kuo, Chung-Shi Liu | 2020-12-08 |
| 10853616 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2020-12-01 |
| 10847304 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2020-11-24 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2020-11-24 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10811384 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2020-10-20 |
| 10797008 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2020-10-06 |
| 10790244 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2020-09-29 |
| 10790269 | Semiconductor devices and semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2020-09-29 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10763229 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2020-09-01 |
| 10762319 | Fingerprint sensor and manufacturing method thereof | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2020-09-01 |