Issued Patents All Time
Showing 251–275 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Chien-Hsiun Lee, Chung-Shi Liu, Hsien-Wei Chen | 2019-10-22 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2019-07-16 |
| 10340236 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2019-07-02 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Yung-Ping Chiang, Chao-Wen Shih, Mirng-Ji Lii | 2019-06-11 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2019-06-04 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2019-04-30 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10268868 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2019-04-23 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269674 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2019-04-23 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2019-04-23 |
| 10269773 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2019-04-23 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10269702 | Info coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hung-Yi Kuo, Ming Hung Tseng | 2019-04-23 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2019-04-23 |
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Ming Hung Tseng, Hung-Yi Kuo | 2018-12-25 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Hua Chen, Chung-Shi Liu +1 more | 2018-12-18 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-12-18 |
| 10153249 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Tin-Hao Kuo, Chung-Shi Liu | 2018-12-11 |
| 10128213 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2018-11-13 |
| 10125014 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Yu-Feng Chen, Yu-Jen Cheng | 2018-11-13 |
| 10121749 | Method of fabricating a post-passivation interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu | 2018-11-06 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2018-10-30 |