Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334457 | Integrated fan-out package | Chuei-Tang Wang, Chieh-Yen Chen, Che-Wei Hsu | 2025-06-17 |
| 12136593 | Electronic apparatus including antennas and directors | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2024-11-05 |
| 12094860 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu | 2024-09-17 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2024-07-09 |
| 11929333 | Integrated fan-out package | Chuei-Tang Wang, Chieh-Yen Chen, Che-Wei Hsu | 2024-03-12 |
| 11854928 | Semiconductor package and manufacturing method thereof | Chuei-Tang Wang, Wei-Ting Chen, Chung-Hao Tsai | 2023-12-26 |
| 11587916 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu | 2023-02-21 |
| 11450628 | Package structure including a solenoid inductor laterally aside a die and method of fabricating the same | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Chia-Chia Lin | 2022-09-20 |
| 11348886 | Integrated fan-out package | Chuei-Tang Wang, Chieh-Yen Chen, Che-Wei Hsu | 2022-05-31 |
| 11335767 | Package structure and method of fabricating the same | Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen | 2022-05-17 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2022-03-22 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu +5 more | 2021-12-28 |
| 11211358 | Packaged semiconductor devices and packaging methods | Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2021-12-28 |
| 11171088 | Electronic apparatus including antennas and directors | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2021-11-09 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10867938 | Package structure | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang | 2020-12-15 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10777518 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chen-Hua Yu, Chieh-Yen Chen, Che-Wei Hsu | 2020-09-15 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2020-08-25 |
| 10672728 | Integrated fan-out package | Chuei-Tang Wang, Chieh-Yen Chen, Che-Wei Hsu | 2020-06-02 |
| 10510714 | Packaged semiconductor devices and packaging methods | Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2019-12-17 |
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu +5 more | 2019-12-17 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |