Issued Patents All Time
Showing 226–250 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734328 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Lin Wang | 2020-08-04 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2020-07-21 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Ming Hung Tseng, Hung-Yi Kuo | 2020-07-21 |
| 10720495 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Chia-Chun Miao | 2020-07-21 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2020-07-07 |
| 10700008 | Package structure having redistribution layer structures | Chih-Hao Chang, Tsung-Hsien Chiang, Tin-Hao Kuo | 2020-06-30 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2020-06-02 |
| 10658258 | Chip package and method of forming the same | Kuo Lung Pan, Tin-Hao Kuo | 2020-05-19 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2020-05-19 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Jen Cheng, Yu-Chih Huang, Chih-Hua Chen, Yu-Feng Chen | 2020-05-19 |
| 10651675 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2020-05-12 |
| 10530175 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2020-01-07 |
| 10522481 | Post-passivation interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu | 2019-12-31 |
| 10510713 | Semicondcutor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2019-12-17 |
| 10510686 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Lin Wang | 2019-12-17 |
| 10510652 | Method of manufacturing semiconductor device | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2019-12-17 |
| 10510631 | Fan out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2019-12-17 |
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10509938 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2019-12-17 |
| 10504810 | Polymer-based-semiconductor structure with cavity | Chen-Hua Yu, Hung-Yi Kuo | 2019-12-10 |
| 10497646 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Ming Hung Tseng, Hsien-Ming Tu | 2019-12-03 |
| 10490468 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2019-11-26 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2019-11-12 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Kuo Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee, Teng-Yuan Lo +1 more | 2019-10-29 |