Issued Patents All Time
Showing 176–200 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2021-10-05 |
| 11133236 | Polymer-based-semiconductor structure with cavity | Chen-Hua Yu, Hung-Yi Kuo | 2021-09-28 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Chung-Shi Liu +1 more | 2021-09-14 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2021-08-31 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2021-08-31 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11075176 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2021-07-27 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2021-06-29 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2021-05-18 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2021-05-18 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Kuo Lung Pan, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2021-05-11 |
| 11004803 | Dummy dies for reducing warpage in packages | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2021-05-11 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 10991649 | Semiconductor device and method of manufacturing semiconductor device | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2021-04-27 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2021-04-20 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2021-04-13 |
| 10978363 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2021-04-13 |