Issued Patents All Time
Showing 276–300 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10097030 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2018-10-09 |
| 10074615 | Package structure and method of fabricating the same | Ying-Cheng Tseng, Chih-Hua Chen, Hsiu-Jen Lin, Kuo-Chung Yee, Chia-Hung Liu | 2018-09-11 |
| 10074472 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2018-09-11 |
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2018-08-28 |
| 10049953 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2018-08-14 |
| 10043770 | System and method for an improved interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2018-08-07 |
| 10020271 | Calibration kits for RF passive devices | Jie Chen, Hsien-Wei Chen, Hung-Yi Kuo | 2018-07-10 |
| 9984965 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Tsung-Yuan Yu | 2018-05-29 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2018-04-24 |
| 9953892 | Polymer based-semiconductor structure with cavity | Hung-Yi Kuo, Chen-Hua Yu | 2018-04-24 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2018-04-17 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hsien-Ming Tu, Shih-Wei Liang, Chang-Pin Huang, Chih-Hua Chen +2 more | 2018-04-17 |
| 9935024 | Method for forming semiconductor structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2018-04-03 |
| 9917072 | Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2018-03-13 |
| 9911724 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu | 2018-03-06 |
| 9905520 | Solder ball protection structure with thick polymer layer | Chen-Hua Yu, Lawrence Chiang Sheu, Chien-Hsiun Lee | 2018-02-27 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-02-27 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo +1 more | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2018-02-20 |
| 9881850 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2018-01-23 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2018-01-16 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |
| 9852985 | Conductive terminal on integrated circuit | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-12-26 |