Issued Patents All Time
Showing 326–350 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543259 | Semiconductor structure with oval shaped conductor | Yung-Ping Chiang, Chao-Wen Shih, Mirng-Ji Lii | 2017-01-10 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu | 2017-01-03 |
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-12-27 |
| 9530757 | Single mask package apparatus | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo | 2016-12-27 |
| 9515036 | Methods and apparatus for solder connections | Chen-Hua Yu, Chien-Hsiun Lee, Chung-Shi Liu, Hsien-Wei Chen | 2016-12-06 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Chang-Pin Huang, Hsien-Ming Tu, Mirng-Ji Lii, Shih-Wei Liang +1 more | 2016-10-04 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai, Tsung-Yuan Yu | 2016-09-20 |
| 9443812 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii, Chen-Hua Yu | 2016-09-13 |
| 9437490 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2016-09-06 |
| 9425112 | Calibration kits for RF passive devices | Jie Chen, Hsien-Wei Chen, Hung-Yi Kuo | 2016-08-23 |
| 9406739 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Tsung-Yuan Yu | 2016-08-02 |
| 9397060 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Kai-Chiang Wu | 2016-07-19 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Yung-Ping Chiang, Shih-Wei Liang, Tsung-Yuan Yu +2 more | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Chao-Wen Shih, Yung-Ping Chiang, Tsung-Yuan Yu | 2016-06-28 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9355978 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-31 |
| 9349655 | Method for mechanical stress enhancement in semiconductor devices | Carlos H. Diaz, Yi-Ming Sheu, Anson Wang, Kong-Beng Thei, Sheng-Chen Chung +3 more | 2016-05-24 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Nien-Fang Wu, Chao-Wen Shih, Yung-Ping Chiang | 2016-05-17 |
| 9343415 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Yung-Ping Chiang, Chen-Chih Hsieh | 2016-05-17 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Yen-Ping Wang, Shih-Wei Liang, Tsung-Yuan Yu | 2016-05-10 |
| 9331023 | Device packaging | Ming-Kai Liu, Yu-Peng Tsai, Kai-Chiang Wu, Wei-Hung Lin, Mirng-Ji Lii | 2016-05-03 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9293606 | Semiconductor device with seal ring with embedded decoupling capacitor | Kuo-Ji Chen, Wei Ma, Ta-Pen Guo, Hsien-Wei Chen | 2016-03-22 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng, Mirng-Ji Lii +1 more | 2016-03-15 |