Issued Patents All Time
Showing 351–375 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275925 | System and method for an improved interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2016-03-01 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Tsung-Ding Wang, Chien-Hsiun Lee, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |
| 9171811 | Bump pad structure | Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2015-10-27 |
| 9165875 | Low profile interposer with stud structure | Chen-Hua Yu, Mirng-Ji Lii, Kai-Chiang Wu | 2015-10-20 |
| 9136318 | Capacitor in post-passivation structures and methods of forming the same | Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2015-09-15 |
| 9123601 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Kai-Chiang Wu | 2015-09-01 |
| 9093411 | Pad structure having contact bars extending into substrate and wafer having the pad structure | Ying-Ju Chen, Hsien-Wei Chen, Mirng-Ji Lii | 2015-07-28 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Chuei-Tang Wang +1 more | 2015-07-14 |
| 9041215 | Single mask package apparatus and method | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo | 2015-05-26 |
| 9035468 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Yung-Ping Chiang, Chen-Chih Hsieh | 2015-05-19 |
| 9013038 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii, Chen-Hua Yu | 2015-04-21 |
| 9000876 | Inductor for post passivation interconnect | Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2015-04-07 |
| 8993355 | Test line placement to improve die sawing quality | Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2015-03-31 |
| 8981580 | Bond pad structure | Shin-Puu Jeng, Yu-Wen Liu, Hsien-Wei Chen | 2015-03-17 |
| 8970001 | Guard ring design for maintaining signal integrity | Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo | 2015-03-03 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2015-02-24 |
| 8916956 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Jui-Pin Hung, Chien-Hsun Lee, Kai-Chiang Wu | 2014-12-23 |
| 8907478 | Bump pad structure | Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2014-12-09 |
| 8884400 | Capacitor in Post-Passivation structures and methods of forming the same | Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2014-11-11 |
| 8860208 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2014-10-14 |
| 8836084 | Structure for reducing integrated circuit corner peeling | Hsien-Wei Chen, Yu-Wen Liu | 2014-09-16 |
| 8749020 | Metal e-fuse structure design | Hsien-Wei Chen, Shin-Puu Jeng, Shih-Hsun Hsu | 2014-06-10 |
| 8749043 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Kai-Chiang Wu | 2014-06-10 |
| 8722529 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Shin-Puu Jeng, Ying-Ju Chen | 2014-05-13 |
| 8703539 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Jui-Pin Hung, Chien-Hsiun Lee, Kai-Chiang Wu | 2014-04-22 |