Issued Patents All Time
Showing 401–420 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013333 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu, Shin-Puu Jeng | 2011-09-06 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Yu-Wen Liu, Hsien-Wei Chen, Ying-Ju Chen, Shin-Puu Jeng | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2011-03-15 |
| 7859092 | Package structures | Benson Liu, Hsien-Wei Chen, Shin-Puu Jeng | 2010-12-28 |
| 7811866 | Single passivation layer scheme for forming a fuse | Shang-Yun Hou, Anbiarshy Wu, Chia-Lun Tsai, Shin-Puu Jeng | 2010-10-12 |
| 7776627 | Flexible structures for interconnect reliability test | Shin-Puu Jeng, Shang-Yun Hou, Anbiarshy Wu | 2010-08-17 |
| 7754601 | Semiconductor interconnect air gap formation process | Hsien-Wei Chen, Shin-Puu Jeng | 2010-07-13 |
| 7732897 | Methods of die sawing and structures formed thereby | Shin-Puu Jeng | 2010-06-08 |
| 7679384 | Parametric testline with increased test pattern areas | Hsien-Wei Chen, Shih-Hsun Hsu, Shin-Puu Jeng | 2010-03-16 |
| 7651893 | Metal electrical fuse structure | Hsueh-Chung Chen, Hsien-Wei Chen, Shin-Puu Jeng, Shang-Yun Hou | 2010-01-26 |
| 7553736 | Increasing dielectric constant in local regions for the formation of capacitors | Hsien-Wei Chen, Hsueh-Chung Chen | 2009-06-30 |
| 7449785 | Solder bump on a semiconductor substrate | Shin-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen, Chia-Lun Tsai | 2008-11-11 |
| 7446398 | Bump pattern design for flip chip semiconductor package | Pao-Kang Niu, Pei-Haw Tsao, Yung Kuan Hsiao, Chung Yu Wang, Shang-Yun Hou +1 more | 2008-11-04 |
| 7397106 | Laser fuse with efficient heat dissipation | Chao-Hsiang Yang, Shang-Yun Hou, Chia-Lun Tsai, Shin-Puu Jeng | 2008-07-08 |
| 7364998 | Method for forming high reliability bump structure | Sung-Cheng Chiu, Hsiu-Mei Yu, Shih-Ming Chen, Shang-Yun Hou | 2008-04-29 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou +2 more | 2007-11-13 |
| 7235424 | Method and apparatus for enhanced CMP planarization using surrounded dummy design | Hsien-Wei Chen, Hsueh-Chung Chen, Shin-Puu Jeng, Jian-Hong Lin, Chih-Tao Lin +1 more | 2007-06-26 |
| 7148089 | Method for forming copper fuse links | Meng-Chi Hung, Shang-Yong Hou | 2006-12-12 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou +2 more | 2006-10-24 |
| 6624073 | Optimized TaCN thin film diffusion barrier for copper metallization | Shi-Chung Sun | 2003-09-23 |