Issued Patents All Time
Showing 376–400 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8685798 | Methods for forming through vias | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Mirng-Ji Lii, Da-Yuan Shih | 2014-04-01 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chung-Ying Yang, Chao-Wen Shih, Hsien-Wei Chen, Mirng-Ji Lii, Tzuan-Horng Liu | 2014-03-11 |
| 8648444 | Wafer scribe line structure for improving IC reliability | Hsien-Wei Chen, Shin-Puu Jeng, Yu-Wen Liu | 2014-02-11 |
| 8643147 | Seal ring structure with improved cracking protection and reduced problems | Shin-Puu Jeng, Shih-Hsun Hsu, Shang-Yun Hou, Chen-Hua Yu | 2014-02-04 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Tung-Liang Shao, Shih-Wei Liang, Ying-Ju Chen, Ching-Jung Yang, Hsien-Wei Chen +2 more | 2013-12-31 |
| 8618673 | Package structures | Benson Liu, Hsien-Wei Chen, Shin-Puu Jeng | 2013-12-31 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2013-12-17 |
| 8581423 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Shin-Puu Jeng, Ying-Ju Chen | 2013-11-12 |
| 8519512 | Test line placement to improve die sawing quality | Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2013-08-27 |
| 8476770 | Apparatus and methods for forming through vias | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Mirng-Ji Lii, Da-Yuan Shih | 2013-07-02 |
| 8450126 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu, Shin-Puu Jeng | 2013-05-28 |
| 8405211 | Bump pad structure | Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2013-03-26 |
| 8373254 | Structure for reducing integrated circuit corner peeling | Hsien-Wei Chen, Yu-Wen Liu | 2013-02-12 |
| 8368180 | Scribe line metal structure | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen, Ming-Yen Chiu | 2013-02-05 |
| 8334582 | Protective seal ring for preventing die-saw induced stress | Shin-Puu Jeng, Hsien-Wei Chen, Shang-Yun Hou, Anbiarshy Wu, Yu-Wen Liu | 2012-12-18 |
| 8278737 | Structure for improving die saw quality | Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu, Shin-Puu Jeng | 2012-10-02 |
| 8237253 | Package structures | Benson Liu, Hsien-Wei Chen, Shin-Puu Jeng | 2012-08-07 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Hsiu-Ping Wei, Shin-Puu Jeng, Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen +1 more | 2012-07-24 |
| 8227917 | Bond pad design for fine pitch wire bonding | Shih-Hsun Hsu, Benson Liu, Chia-Lun Tsai, Hsien-Wei Chen, Anbiarshy Wu +2 more | 2012-07-24 |
| 8203209 | Bond pad design for reducing the effect of package stress | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2012-06-19 |
| 8178980 | Bond pad structure | Shin-Puu Jeng, Yu-Wen Liu, Hsien-Wei Chen | 2012-05-15 |
| 8125233 | Parametric testline with increased test pattern areas | Hsien-Wei Chen, Shih-Hsun Hsu, Shin-Puu Jeng | 2012-02-28 |
| 8125052 | Seal ring structure with improved cracking protection | Shin-Puu Jeng, Shih-Hsun Hsu, Shang-Yun Hou, Chen-Hua Yu | 2012-02-28 |
| 8058151 | Methods of die sawing | Shin-Puu Jeng | 2011-11-15 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen, Hsiu-Ping Wei | 2011-10-04 |