Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7233075 | Bonding pad structure | Shang-Yung Hou, Shin-Puu Jeng | 2007-06-19 |
| 7148089 | Method for forming copper fuse links | Hao-Yi Tsai, Shang-Yong Hou | 2006-12-12 |
| 7057296 | Bonding pad structure | Shang-Yung Hou, Shin-Puu Jeng | 2006-06-06 |