SH

Shang-Yung Hou

TSMC: 2 patents #6,667 of 12,232Top 55%
Overall (All Time): #2,158,613 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7233075 Bonding pad structure Meng-Chi Hung, Shin-Puu Jeng 2007-06-19
7057296 Bonding pad structure Meng-Chi Hung, Shin-Puu Jeng 2006-06-06