Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589915 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Wen-Hsin Chan | 2017-03-07 |
| 9379076 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chao-Wen Shih, Yung-Ping Chiang, Tsung-Yuan Yu | 2016-06-28 |
| 9343415 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai | 2016-05-17 |
| 9035468 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai | 2015-05-19 |