Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218035 | Barrier structures between external electrical connectors | Kai-Chiang Wu, Shih-Wei Liang | 2025-02-04 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2024-02-06 |
| 11296012 | Barrier structures between external electrical connectors | Shih-Wei Liang, Kai-Chiang Wu | 2022-04-05 |
| 11195864 | Flip-chip sample imaging devices with self-aligning lid | Ming Zhang, Yin Qian, Dyson H. Tai | 2021-12-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2021-08-24 |
| 10985117 | Solder ball protection in packages | Shih-Wei Liang, Kai-Chiang Wu | 2021-04-20 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10892290 | Interconnect layer contact and method for improved packaged integrated circuit reliability | Yin Qian, Ming Zhang, Dyson H. Tai | 2021-01-12 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10761385 | Liquid crystal on silicon panel having less diffraction | Ming Zhang, Libo Weng, Cheng Zhao, Yin Qian, Zhiqiang Lin +1 more | 2020-09-01 |
| 10720495 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo | 2020-07-21 |
| 10510689 | Solder ball protection in packages | Shih-Wei Liang, Kai-Chiang Wu | 2019-12-17 |
| 10418408 | Curved image sensor using thermal plastic substrate material | Yuanwei Zheng, Gang Chen, Yin Qian, Duli Mao, Dyson H. Tai +1 more | 2019-09-17 |
| 10347563 | Barrier structures between external electrical connectors | Kai-Chiang Wu, Shih-Wei Liang | 2019-07-09 |
| 10297627 | Chip scale package for an image sensor | Yin Qian, Chen Lu, Jin Li, Ming Zhang, Dyson H. Tai | 2019-05-21 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2019-04-23 |
| 10211243 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2019-02-19 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu | 2018-12-18 |
| 10147751 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2018-12-04 |
| 10049990 | Solder ball protection in packages | Shih-Wei Liang, Kai-Chiang Wu | 2018-08-14 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2018-07-31 |
| 9966404 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2018-05-08 |
| 9966396 | High dynamic range image sensor with reduced sensitivity to high intensity light | Yin Qian, Ming Zhang, Chen Lu, Jin Li, Dyson H. Tai | 2018-05-08 |
| 9953966 | Semiconductor device and method of forming the same | Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang | 2018-04-24 |