Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408463 | Trench balance structure pattern in red photodiodes of a pixel array with quad bayer color filter | Chao Niu, Zhiqiang Lin | 2025-09-02 |
| 12289924 | Transistors having increased effective channel width | Chiao-Ti Huang, Sing-Chung Hu, Bill Phan | 2025-04-29 |
| 12262563 | Pixel cell having anti-blooming structure and image sensor | Shiyu Sun, Gang Chen, Sing-Chung Hu, Armin Yazdani | 2025-03-25 |
| 12176364 | Passivation-enhanced image sensor and surface-passivation method | Shiyu Sun | 2024-12-24 |
| 11862678 | Electrical isolation in pixel-array substrates using combination of doped semiconductor guard rings and overlapping isolation trenches | Sing-Chung Hu, Gang Chen, Dyson H. Tai, Lindsay Grant | 2024-01-02 |
| 11750906 | Fully buried color filter array of image sensor | Gang Chen, Qin Wang, Cunyu Yang, Guannan Chen, Duli Mao +2 more | 2023-09-05 |
| 11245823 | Fully buried color filter array of image sensor | Gang Chen, Qin Wang, Cunyu Yang, Guannan Chen, Duli Mao +2 more | 2022-02-08 |
| 10964738 | Image sensor having a source follower transistor with a multi-thickness gate dielectric | Gang Chen, Qin Wang, Cunyu Yang, Guannan Chen, Duli Mao +4 more | 2021-03-30 |
| 10734434 | Vertical overflow drain combined with vertical transistor | Gang Chen, Duli Mao, Dyson H. Tai, Lindsay Grant | 2020-08-04 |
| 10566364 | Resonant-filter image sensor and associated fabrication method | Gang Chen, Duli Mao, Dyson H. Tai, Lequn Liu | 2020-02-18 |
| 10418408 | Curved image sensor using thermal plastic substrate material | Chia-Chun Miao, Gang Chen, Yin Qian, Duli Mao, Dyson H. Tai +1 more | 2019-09-17 |
| 10290670 | Resonant-filter image sensor and associated fabrication method | Gang Chen, Duli Mao, Dyson H. Tai, Lequn Liu | 2019-05-14 |
| 10269850 | Biased deep trench isolation | Gang Chen, Duli Mao, Dyson H. Tai, Yi Ma | 2019-04-23 |
| 9806117 | Biased deep trench isolation | Gang Chen, Duli Mao, Dyson H. Tai, Yi Ma | 2017-10-31 |
| 9773829 | Through-semiconductor-via capping layer as etch stop layer | Gang Chen, Duli Mao, Dyson H. Tai | 2017-09-26 |
| 9691810 | Curved image sensor | Gang Chen, Duli Mao, Dyson H. Tai, Arvind Kumar, Hung-Chih Chang +1 more | 2017-06-27 |
| 9564470 | Hard mask as contact etch stop layer in image sensors | Gang Chen, Duli Mao, Dyson H. Tai | 2017-02-07 |
| 9565405 | Image sensor with enhanced quantum efficiency | Gang Chen, Dominic Massetti, Chih-Wei Hsiung, Arvind Kumar, Duli Mao +1 more | 2017-02-07 |
| 9484373 | Hard mask as contact etch stop layer in image sensors | Gang Chen, Duli Mao, Dyson H. Tai | 2016-11-01 |
| 9472587 | Storage transistor with optical isolation | Xianmin Yi, Gang Chen, Duli Mao, Dyson H. Tai | 2016-10-18 |
| 9455291 | Blue enhanced image sensor | Gang Chen, Duli Mao, Chih-Wei Hsiung, Arvind Kumar, Dyson H. Tai | 2016-09-27 |
| 9240431 | Conductive trench isolation | Gang Chen, Duli Mao, Dyson H. Tai, Chih-Wei Hsiung, Arvind Kumar | 2016-01-19 |
| 9111993 | Conductive trench isolation | Gang Chen, Duli Mao, Dyson H. Tai, Chih-Wei Hsiung, Arvind Kumar | 2015-08-18 |
| 7221035 | Semiconductor structure avoiding poly stringer formation | Julian Chang | 2007-05-22 |